
Channel: Corning Incorporated
Category: Science & Technology
Tags: laser technologiesglasslaser dicing
Description: Corning Laser Technologies has developed a new glass wafer dicing method, based on the patented nanoPerforation technology. By uniting this innovative process with a well-established breaking technology, Corning Laser Technologies presents an industry-leading glass wafer dicing solution. Learn more: bit.ly/3nS1kG1 Please note: this video contains fast-flashing images and lights.



















