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Corning Laser Technologies: Novel Glass Wafer Dicing

Duration: 00:16Views: 1.7KLikes: 33Date Created: Oct, 2021

Channel: Corning Incorporated

Category: Science & Technology

Tags: laser technologiesglasslaser dicing

Description: Corning Laser Technologies has developed a new glass wafer dicing method, based on the patented nanoPerforation technology. By uniting this innovative process with a well-established breaking technology, Corning Laser Technologies presents an industry-leading glass wafer dicing solution. Learn more: bit.ly/3nS1kG1 Please note: this video contains fast-flashing images and lights.

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